发明名称 POLYAMIDE MOLDING MATERIAL AND USE OF THE MATERIAL FOR PRODUCING LED HOUSING MEMBER
摘要 <P>PROBLEM TO BE SOLVED: To provide a molding material containing a semi-aromatic polyamide as a base material which is suitable for producing a white housing member for a light emitting diode (LED). <P>SOLUTION: This polyamide molding material is a polyamide molding material containing as a base material, a semi-crystalline polyamide for producing an LED housing or housing member having high strength and high long period reflectance and hardly causing blistering, which contains (A) 40 to 80 mass% of at least one type of semi-aromatic polyamide (having a melting temperature (Tm) of 270&deg;C to 340&deg;C) containing as base materials, at least 70 mol% of an aromatic dicarboxylic acid and at least 70 mol% of an aliphatic diamine (having 4 to 18 carbon atoms), (B) 10 to 30 mass% of titanium dioxide particles, (C) 5 to 20 mass% of a glass fiber, and (D) 5 to 30 mass% of calcium carbonate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011241398(A) 申请公布日期 2011.12.01
申请号 JP20110110334 申请日期 2011.05.17
申请人 EMS-PATENT AG 发明人 LAMBERTS NIKOLAI;BAYER ANDREAS;HEWEL MANFRED;HOFF HEINZ
分类号 C08L77/06;C08K3/22;C08K3/26;C08K7/14;C08K9/00 主分类号 C08L77/06
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