| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding film-attached substrate for reliably substrates even if they are the ones whose main component is not silicon dioxide (SiO<SB>2</SB>), or that does not have an Si-group skelton, or when one substrate is bonded with the other substrate whose main component is not silicon dioxide (SiO<SB>2</SB>) or that does not have an Si-group skelton, and to provide a method of manufacturing the same. <P>SOLUTION: The bonding film-attached substrate includes: an IR absorption glass member 2 whose main component is not silicon dioxide, or that does not have the Si-group skeleton; a silicon oxide film 6 that is formed on a surface of the IR absorption glass member 2 adjacent to the substrate using a vapor-phase deposition method, and that has a thickness of 100-2,000 nm; and a bonding film 7 provided by plasma polymerization on the silicon oxide film 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
