| 摘要 |
<p>The device has a set of heat sinks (102) with form-fit structures provided at opposite edge areas of fluid channels (106), where the heat sinks are arranged next to each other. The heat sinks are connected with each other by the opposite form-fit structures using a form-fit connection and/or an adhesive bond connection. A collector (104) is connected with the heat sinks, and end sections of the fluid channels of the two heat sinks are discharged into an opening of the collector, where the heat sinks are formed as extrusion profiles and made of metal or plastic. An independent claim is also included for a method for manufacturing a cooling device.</p> |
