发明名称 |
HEAT DISSIPATING ASSEMBLY |
摘要 |
PURPOSE: A heat dissipating assembly is provided to increase assembly efficiency using a smaller number of components, thereby reducing manufacturing costs. CONSTITUTION: A heat dissipating assembly comprises a circuit board(1), heating devices(2), heat dissipating units(3), and a heat conductive adhesive. The circuit board is inserted between the heating devices and the heat dissipating units. The circuit board has the first side(11) and the second side(12) which face each other. The circuit board includes through holes(13) and connection components(14). The heating devices include two pins(21) and a heat conducting part. A heat dissipating unit comprise a main body(31) and a plurality of pins. |
申请公布号 |
KR20110126508(A) |
申请公布日期 |
2011.11.23 |
申请号 |
KR20100095748 |
申请日期 |
2010.10.01 |
申请人 |
SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. |
发明人 |
HORNG ALEX;KUO CHI HUNG;CHUNG CHIH HAO |
分类号 |
H05K7/20;F21V29/00;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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