| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform reduction in cost and enhancement in conductive performance by increasing a particle capture rate of a conductive resin film sheet. <P>SOLUTION: In a conductive resin film sheet having in a thickness direction two or more layers of a resin film layer containing conductive particles or a resin film layer containing no conductive particle, a resin film layer containing therein a center plane in the thickness direction which is located at an equal distance from both the surfaces of the resin film sheet or at least one resin film layer adjacent to the center plane in the thickness direction is formed of an insulating resin film layer containing no conductive particle therein. When the sum of the heights of a pair of electrodes of an electronic part to be connected is represented by H1, the average value of the electrode width is represented by W1 and the pitch of the electrodes is represented by W2, the electronic part is electrically connected by the resin film sheet in which the whole thickness of resin film material mounted between the electrodes is equal to "((W2-W1)/W2)×H1 + particle diameter" or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
