发明名称 ELEKTRODEN-LEITUNGS-VERBINDUNG MIT BILDGEBUNG NACH DER IMPLANTATION
摘要 In general, the disclosure is related to characterization of implanted electrical stimulation electrode arrays using post-implant imaging. The electrode arrays may be carried by implanted leads. Characterization of implanted electrode arrays may include identification of the type or types of leads implanted within a patient and/or determination of positions of the implanted leads or electrodes carried by the leads relative to one another or relative to anatomical structures within the patient. In addition, the disclosure relates to techniques for specifying or modifying patient therapy parameters based on the characterization of the implanted electrode arrays.
申请公布号 AT531421(T) 申请公布日期 2011.11.15
申请号 AT20090705199T 申请日期 2009.01.23
申请人 MEDTRONIC, INC. 发明人 GOETZ, STEVEN;NG, ANDREW
分类号 A61N1/05;G06T7/60 主分类号 A61N1/05
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