SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A semiconductor light emitting device package is provided to arrange a layer of a first fluorescent substance along a light transmitting surface of an encapsulating material, thereby preventing the degradation of light emitting efficiency due to a junction of a fluorescent substance layer and the encapsulating material. CONSTITUTION: A semiconductor light emitting device(110) is included in a frame and generates light with a first wavelength. An encapsulating material(130) encapsulates the semiconductor light emitting device and includes a light transmitting surface which is emitting light by being fixed in the frame. A first fluorescent substance layer(131) is arranged in the encapsulating material along the light transmitting surface and converts a part of the light with the first wavelength into the light with a second wavelength different from the first wavelength. The first fluorescent substance layer is arranged with a uniform thickness.