| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a prober having a high through-put when inspecting at high or low temperature. <P>SOLUTION: The prober comprises a wafer chuck 18 holding a wafer W that has plural semiconductor chips and a card holder 24 holding a probe card 25 that has a probe 26. The prober further comprises a movement mechanism that relatively moves the wafer chuck 18 to the probe 26, and a movement control unit that controls the movement mechanism and controls to repeat a contact action that brings the probe 26 into contact with an electrode pad of the semiconductor chip. The movement control unit includes a diagonal movement sequence that controls to bring the probes 26 into contact with the semiconductor chip positioned near the diagonal of a certain semiconductor chip in which the contact action with respect to the center of the wafer W has been ended, in a next contact action after the contact action of the semiconductor chip has been ended. <P>COPYRIGHT: (C)2012,JPO&INPIT |
