| 摘要 |
PURPOSE: A method of manufacturing a multi layer printed circuit board is provided to simplify a process by forming a plurality of circuit patterns at the same time. CONSTITUTION: In a method of manufacturing a multi layer printed circuit board, first and the second metal laminated plate comprise a metal layer in the both sides of the insulating layer The first and the second metal laminated plate are prepared(S110) The first and the second metal laminated plate are patterned to from the circuit pattern(S120) The circuit pattern is formed in the both sides of the first metal laminated plate. A primer resin is coated in at least one side of the first metal laminated plate(S130).
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