ROUTING METHOD FOR FLIP CHIP PACKAGE AND APPARATUS USING THE SAME

摘要

The present invention pertains to a routing method and device for a flip-chip package. The aforementioned flip chip includes several outer pads and several inner pads. The aforementioned routing method includes the following steps: setting an outer sequence based on the arrangement order of the aforementioned outer pads; setting several inner sequences based on the connection relationships between aforementioned inner pads and the aforementioned outer pads; calculating the longest common subsequence of each inner sequence and the aforementioned outer sequence, defining the connection relationships between the aforementioned inner pads and the aforementioned outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the aforementioned inner pads and the aforementioned outer pads that do not correspond to the aforementioned longest common subsequence as detour connections; establishing the routing scheme of the aforementioned flip chip based on the connection relationships between the aforementioned inner pads and the aforementioned outer pads.