| 摘要 |
An image acquisition system, in particular for automotive applications, includes: a substrate; an image sensor mounted on the substrate and contacted via contact points; an optically transparent sealing compound that covers the image sensor, the contact points, and a portion of the upper substrate side; an optical device being arranged or secured in or on the sealing compound. The optical device can be placed into the sealing compound after shaping of the sealing compound or directly. Furthermore, the optical device can also be arranged directly by shaping the sealing compound. Manufacture of the image acquisition system can be incorporated into a board populating process.
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