发明名称 THERMAL CONDUCTIVE SHEET, LIGHT-EMITTING DIODE MOUNTING SUBSTRATE, AND THERMAL CONDUCTIVE ADHESIVE SHEET
摘要 A thermal conductive sheet contains a plate-like boron nitride particle, has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and has a volume resistivity of 1×1010Ω·cm or more. The transmittance of light at a wavelength of 500 nm is 10% or less. The surface reflectance R of light at 500 nm is 70% or more relative to the surface reflectance of barium sulfate as 100%. A light-emitting diode mounting substrate includes a substrate for mounting a light-emitting diode; and a thermal conductive light reflection layer being formed on the surface of the substrate and including the above-described thermal conductive sheet. A thermal conductive adhesive sheet includes a thermal conductive layer including the above-described thermal conductive sheet, and an adhesive layer or a pressure-sensitive adhesive layer laminated on at least one side of the thermal conductive layer.
申请公布号 US2011262728(A1) 申请公布日期 2011.10.27
申请号 US201113016685 申请日期 2011.01.28
申请人 NITTO DENKO CORPORATION 发明人 IZUTANI SEIJI;UCHIYAMA HISAE;FUKUOKA TAKAHIRO;HARA KAZUTAKA;HIRANO HITOTSUGU
分类号 B32B3/00;B32B5/16 主分类号 B32B3/00
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