| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device of grinding a hard substrate, capable of forming into the predetermined thickness without breaking by improving biting of a grinding stone and preventing slip even in case of the hard substrate, such as a sapphire substrate or silicon carbide substrate.SOLUTION: The method includes a first grinding process to start grinding by making a grinding face of the grinding stone 327 work on the hard substrate while a retaining face 551 of a chuck table 55 is set to a non-parallel state to the grinding face 327a of the grinding stone 327, and a second grinding process to grind by gradually changing the non-parallel state between the retaining face 551 of the chuck table and the grinding face 327a of the grinding stone 327 to a parallel state after proceeding grinding by the grinding stone 327 in the first grinding process, and making the grinding face 327a of the grinding stone 327 work on the hard substrate. |
