发明名称 SUBSTRATE-PROCESSING APPARATUS AND METHOD FOR MEASURING PROCESSING-LIQUID TEMPERATURE
摘要 PROBLEM TO BE SOLVED: To provide a substrate-processing apparatus and method for measuring the temperature of a processing liquid, accurately measuring the temperature of the processing liquid supplied to a substrate.SOLUTION: The processing liquid discharged from a nozzle 5 is supplied to the upper surface of a wafer W. The temperature of the processing liquid flowing on the upper surface of the wafer W is detected by a radiation thermometer 6. A radiation-detecting value when the processing liquid is discharged really from the nozzle 5 to detect its temperature by the radiation thermometer 6 is stored in a memory in association with a thermocouple-detecting value when the temperature of the processing liquid is measured by means of a thermocouple thermometer. A corresponding formula of the radiation-detecting value and the thermocouple-detecting value in accordance with the processing liquid is formed on the basis of the radiation-detecting value and the thermocouple-detecting value. The temperature of the processing liquid is calculated by correcting the detection value of the radiation thermometer 6 by means of the corresponding formula of the radiation-detecting value and the thermocouple-detecting value in accordance with the processing liquid.
申请公布号 JP2011211092(A) 申请公布日期 2011.10.20
申请号 JP20100079525 申请日期 2010.03.30
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KOBAYASHI TOMOYUKI;FUJIKAWA KAZUNORI;SONODA ATSUSHI;ITAHARA TAKAO
分类号 H01L21/304;H01L21/027 主分类号 H01L21/304
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