| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling device and a peeling method for peeling an FPC from a metal plate without giving damage to a soldered electronic component.SOLUTION: The peeling device includes a roller 120 having a slit portion 121 into which a second plate adhered to a first plate with adhesive is inserted, and a scraper 110 having a blade at the front end, and fixed to a position where the front end enters into the layer of the adhesive. The roller is rotated to roll the second plate inserted into the slit portion. The scraper enters into the layer of the adhesive moved with the second plate rolled by the roller, to peel the first plate from the second plate. |
