LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a new liquid epoxy resin composition not accompanied by the deterioration of the reinforcement function to a package and improving resin crack resistance, and to provide a semiconductor device with a flip chip connecting part reinforced by a cured product using the composition.SOLUTION: The epoxy resin composition contains (A) epoxy resin which is liquid at a normal temperature, (B) a curing agent, and (C) an inorganic filler as essential components, wherein talc is contained as (C) the inorganic filler within a range of 0.5-10 mass% based on the total amount of the composition.