| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor wafer, capable of reducing the number of test pads, and capable of testing each transistor individually in a wafer state.SOLUTION: A plurality of semiconductor devices 2 are arranged in matrix in a semiconductor wafer 1. Dicing lines 3 are provided in order to separate the plurality of semiconductor devices 2. Each semiconductor device 2 includes a plurality of transistors 4. A plurality of test pads 5 (first test pads) are connected individually to the collectors (first terminals) of the plurality of transistors 4. A ground electrode 11 is connected commonly to the emitters (second terminals) of the plurality of transistors 4. A test pad 7 (second test pad) is connected commonly to the bases (control terminals) of the plurality of transistors 4 via wiring 6 which passes through the dicing line 3. |
