发明名称 Heat pump system
摘要 <p>A heat pump system (1) is equipped with a heat-source-side coolant circuit (20) which has a heat-source-side compressor (21), a first use-side heat exchanger (41a) which functions as a radiator for heat-source-side coolant, and a heat-source-side heat exchanger (24) which acts as a radiator for heat-source-side coolant; and a use-side coolant circuit (40a) which has a use-side compressor (62a), a coolant-water heat exchanger (65a) which functions as a radiator for use-side coolant and heats an aqueous medium, and a first use-side heat exchanger (41a) which functions as an evaporator for the use-side coolant by means of heat radiation from the heat-source-side coolant. The heat pump system (1) regulates the capacity of the heat-source-side compressor (21) such that the saturation temperature corresponding to the pressure of the heat-source-side coolant during discharge from the heat-source-side compressor (21) meets a target temperature, and regulates the capacity of the use-side compressor (62a) such that the saturation temperature corresponding to the pressure of the use-side coolant during discharge from the use-side compressor (62a) meets a target temperature.</p>
申请公布号 AU2010219037(A1) 申请公布日期 2011.10.13
申请号 AU20100219037 申请日期 2010.02.23
申请人 DAIKIN INDUSTRIES, LTD.;DAIKIN EUROPE N.V. 发明人 HONDA, MASAHIRO
分类号 F25B7/00;F25B1/00;F25B13/00 主分类号 F25B7/00
代理机构 代理人
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