| 摘要 |
<p>The disclosed method of forming microstructures involves a step (A) for irradiating, with a laser having a pulse duration on the order of picoseconds or shorter, the region where microstructures configuring holes in a substrate are to be formed and scanning a focus, at which the aforementioned laser is focused, to form a reformed portion, and a step (B) for etching the aforementioned substrate on which the aforementioned reformed portion is formed and removing said reformed portion to form microstructures. In the aforementioned step (A), a linearly polarized laser is used as the aforementioned laser, and said laser is irradiated such that the orientation of the aforementioned linearly polarized light is fixed in direction relative to the scanning direction of the aforementioned focus point.</p> |
