| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate mounting device in which production tact is high, and mounting components can be reliably stuck to a mounting substrate, and a substrate mounting method using the substrate mounting device.SOLUTION: A plurality of substrate side heating members 24A, 24B, 24C divided so as to be associated with of a plurality of the mounting components 16A, 16B, 16C, respectively, mounted to the mounting substrate 14 are prepared in a substrate holding member 20. Thermosetting resin 18 is heated by the substrate side heating member 24 only at a part to which the mounting component 16 is mounted. The thermosetting resin 18 is prevented from being hardened at a part to which the mounting component 16 has not yet mounted. |
