| 摘要 |
PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy for high temperature excellent in wettability and reliability, and also to provide a method for producing the same.SOLUTION: The coated Pb-free solder alloy has a sheet shape, a wire shape or a ball shape and is comprised of the Pb-free solder alloy containing ≥50 mass% and ≤99.5 mass% of Bi and a coating layer coated on a surface, having a thickness of ≥0.05 μm and ≤1.20 μm and comprising at least one element of Ag, Au, Cu and Ni. This Pb-free solder alloy may contain ≥0.4 mass% and ≤13.5 mass% of Zn and/or ≥0.01 mass% and ≤1.5 mass% of Sn, and further may contain ≥0.02 mass% and ≤2.5 mass% of Al and/or ≥0.001 mass% and ≤0.500 mass% of P. |
