| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning processing apparatus that saves pure water and reduces an amount of drainage, and also shortens a processing time when carrying out washing processing of a substrate having been subjected to liquid chemical processing, and achieves space saving and reduction in manufacturing cost of the whole apparatus.SOLUTION: A washing processing chamber 10 in which the washing processing is carried out to the substrate W having been subjected to the liquid chemical processing, has a substitution washing area 201, a washing area 202 and a direct washing area 203 defined in this order in a substrate transfer direction, and an inlet nozzle 16, a high-pressure nozzle 18, a forcible discharge nozzle 100, and an air nozzle 22 are arranged respectively in the substitution washing area 201. Control is so performed as to start discharging washing water from the inlet nozzle 16, high-pressure nozzle 18 and forcible discharge nozzle 100 before the substrate W is carried in the substitution washing area 201, and to stop discharging the washing water from the inlet nozzle 16, high-pressure nozzle 18 and forcible discharge nozzle 100 after the substrate W is carried out of the substitution washing area 201. |
