发明名称 |
Encapsulated Semiconductor Chip with External Contact Pads and Manufacturing Method Thereof |
摘要 |
A method includes providing a carrier; applying a dielectric layer to the carrier; applying a metal layer to the dielectric layer; placing a first semiconductor chip on the metal layer with contact pads of the first semiconductor chip facing the metal layer; covering the first semiconductor chip with an encapsulation material; and removing the carrier.
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申请公布号 |
US2011233754(A1) |
申请公布日期 |
2011.09.29 |
申请号 |
US20100749192 |
申请日期 |
2010.03.29 |
申请人 |
MEYER-BERG GEORG |
发明人 |
MEYER-BERG GEORG |
分类号 |
H01L23/488;H01L21/56;H01L21/60 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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