| 摘要 |
A high-power LED package includes a thermal conductive substrate, a circuit layer formed on the top wall of the thermal conductive substrate, a LED chip mounted on the top wall of the thermal conductive substrate, lead wires electrically connected between the LED chip and the circuit layer, and a packaging layer covering the LED chip, the lead wires and the connection areas between the lead wires and the circuit layer outside the bottom wall of the thermal conductive substrate for enabling waste heat to be directly transferred from the LED chip to the thermal conductive substrate and then rapidly dissipated into the outside open air by the thermal conductive substrate during operation of the LED chip.
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