发明名称 |
Copper electroplating bath and method |
摘要 |
<p>Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.</p> |
申请公布号 |
EP2366686(A2) |
申请公布日期 |
2011.09.21 |
申请号 |
EP20110158232 |
申请日期 |
2011.03.15 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
NIAZIMBETOVA, ZUKHRA L. |
分类号 |
C07D233/02;C07D233/60;C07D295/088;C07D295/13;C07D333/04;C25D3/38;H05K3/42 |
主分类号 |
C07D233/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|