发明名称 Method and device for controlling the generation of ultrasonic wire bonds
摘要 A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.
申请公布号 US8020746(B2) 申请公布日期 2011.09.20
申请号 US20070439883 申请日期 2007.09.04
申请人 TECHNISCHE UNIVERSITAET BERLIN;FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 发明人 GEISSLER UTE;REICHL HERBERT;GAUL HOLGER;LANG KLAUS-DIETER;SCHNEIDER-RAMELOW MARTIN
分类号 B23K20/10;B23K1/06 主分类号 B23K20/10
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