发明名称 |
Positive resist composition, method of forming resist pattern, and polymeric compound |
摘要 |
There is provided a positive resist composition, including a base component (A) which exhibits increased solubility in an alkali developing solution under action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the base component (A) includes a polymeric compound (A1) containing a structural unit (a0) represented by the general formula (a0-1) shown below: (wherein, R1 represents a hydrogen atom, a lower alkyl group or a halogenated lower alkyl group; A represents a bivalent linking group; B represents a bivalent linking group; and R2 represents an acid dissociable, dissolution inhibiting group).
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申请公布号 |
US8021823(B2) |
申请公布日期 |
2011.09.20 |
申请号 |
US20090372964 |
申请日期 |
2009.02.18 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
SHIMIZU HIROAKI;NAKAMURA TSUYOSHI;DAZAI TAKAHIRO;SHIONO DAIJU;HIRANO TOMOYUKI |
分类号 |
G03F7/039;G03F7/20;G03F7/30 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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