发明名称 COMPOSITION CONTAINING NEW COMPOUND, AND ELECTRONIC DEVICE MANUFACTURED FROM SUCH COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a new compound useful as a hole transport material in manufacture of an electronic device. SOLUTION: The invention relates to a new compound, a composition containing a new oligomer and polymer, and an electronic device including at least one layer containing the composition. The new oligomer and polymer can be solubilized and can be used in a solution to form the electronic device. The compounds can function as a monomer, and a copolymer can be formed from such a monomer, such a copolymer containing a plurality of units of the compound as a polymerization unit. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011173893(A) 申请公布日期 2011.09.08
申请号 JP20110074540 申请日期 2011.03.30
申请人 E I DU PONT DE NEMOURS & CO 发明人 HERRON NORMAN;JOHANSSON GARY A;RADU NORA SABINA;SMITH ERIC MAURICE;DABROWSKI ARTHUR;GENTRY FREDERICK P;ROSSI GENE M
分类号 C07C211/58;C07C15/00;C07C23/00;C07C209/00;C07C211/00;C07C211/59;C07C217/92;C08G61/12;C09K11/06;H01L51/50;H05B33/14 主分类号 C07C211/58
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