发明名称 |
COMPOSITION CONTAINING NEW COMPOUND, AND ELECTRONIC DEVICE MANUFACTURED FROM SUCH COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a new compound useful as a hole transport material in manufacture of an electronic device. SOLUTION: The invention relates to a new compound, a composition containing a new oligomer and polymer, and an electronic device including at least one layer containing the composition. The new oligomer and polymer can be solubilized and can be used in a solution to form the electronic device. The compounds can function as a monomer, and a copolymer can be formed from such a monomer, such a copolymer containing a plurality of units of the compound as a polymerization unit. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011173893(A) |
申请公布日期 |
2011.09.08 |
申请号 |
JP20110074540 |
申请日期 |
2011.03.30 |
申请人 |
E I DU PONT DE NEMOURS & CO |
发明人 |
HERRON NORMAN;JOHANSSON GARY A;RADU NORA SABINA;SMITH ERIC MAURICE;DABROWSKI ARTHUR;GENTRY FREDERICK P;ROSSI GENE M |
分类号 |
C07C211/58;C07C15/00;C07C23/00;C07C209/00;C07C211/00;C07C211/59;C07C217/92;C08G61/12;C09K11/06;H01L51/50;H05B33/14 |
主分类号 |
C07C211/58 |
代理机构 |
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主权项 |
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地址 |
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