| 摘要 |
The apparatus includes a rotary mechanism for holding a semiconductor wafer and rotating the same, a detection mechanism for detecting a positioning cutout portion formed in the wafer, and a wafer transfer mechanism for lifting the wafer from a wafer mounting portion of the rotary mechanism or mounting the wafer on the same. The wafer transfer mechanism has a movable holding portion for holding the wafer at a position just above the wafer mounting portion and is constituted such that the movable holding portion moves up or down while avoiding the wafer held by the rotary mechanism.
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