Package for semiconductor device and method of manufacturing the same

摘要

In a package for a semiconductor device, a core substrate (12) has two metal plates (20a, 20b), each of which includes a first through hole (16), a second through hole (22), a projection (24), and an insulating layer (26) formed on its surface. The metal plates are stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate. A tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed.