发明名称 |
Semiconductor device having pads |
摘要 |
A semiconductor device having pads is provided. The semiconductor device includes first pads formed along a first row, and second pads formed along a second row. The first via contact portions extending from the first pads toward the second row, and second via contact portions extending from the second pads toward the first row. The first and second via contact portions are arranged along a third row between the first and second rows.
|
申请公布号 |
US8013455(B2) |
申请公布日期 |
2011.09.06 |
申请号 |
US20070892318 |
申请日期 |
2007.08.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
AHN JEONG-HOON;SHIN HEON-JONG;LEE SUNG-HOON |
分类号 |
H01L23/488 |
主分类号 |
H01L23/488 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|