发明名称 |
ETCHING METHOD FOR COPPER OR COPPER ALLOY |
摘要 |
PROBLEM TO BE SOLVED: To provide an etching method for copper or copper alloy that is used for manufacturing a printed wiring board, having a fine wiring pattern, with an excellent yield and without causing a short-circuit defect when executing etching by an etchant containing a banking agent. SOLUTION: The etching method of copper or copper alloy is configured as follows. The surface of copper or a copper alloy is polished by chemical polishing. Then, a resist pattern is formed on the surface of the copper or the copper alloy. The surface of the copper or the copper alloy is etched by an etchant containing a banking agent. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011171323(A) |
申请公布日期 |
2011.09.01 |
申请号 |
JP20100030869 |
申请日期 |
2010.02.16 |
申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
ISHIDA MARIKO;YAMANE KENGO;KATO MAKOTO |
分类号 |
H05K3/06;C23F1/00;C23F1/02 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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