发明名称 ETCHING METHOD FOR COPPER OR COPPER ALLOY
摘要 PROBLEM TO BE SOLVED: To provide an etching method for copper or copper alloy that is used for manufacturing a printed wiring board, having a fine wiring pattern, with an excellent yield and without causing a short-circuit defect when executing etching by an etchant containing a banking agent. SOLUTION: The etching method of copper or copper alloy is configured as follows. The surface of copper or a copper alloy is polished by chemical polishing. Then, a resist pattern is formed on the surface of the copper or the copper alloy. The surface of the copper or the copper alloy is etched by an etchant containing a banking agent. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011171323(A) 申请公布日期 2011.09.01
申请号 JP20100030869 申请日期 2010.02.16
申请人 MITSUBISHI PAPER MILLS LTD 发明人 ISHIDA MARIKO;YAMANE KENGO;KATO MAKOTO
分类号 H05K3/06;C23F1/00;C23F1/02 主分类号 H05K3/06
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