| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress generation of a resin burr on a back face of a lead while preventing the lead from being shifted from a desired arrangement. <P>SOLUTION: This lead frame 100 includes: die pads 1; a plurality of leads 2 arranged around the die pads 1; die bars 31 adjacent to the outer sides of the plurality of leads 2 and connecting the plurality of leads 2 to one another; and peripheral parts 4 adjacent to the outer sides of the die bars 31. A first recessed part 21 is formed on the back face of the peripheral part 4, a second recessed part 22 is formed continuously to the first recessed part 21 on the back face of the die bar 31, and the second recessed part 22 communicates with a space 7 between the die bar 31 and the die pad 1. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
