| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board preventing mutual short-circuit of electrode pads in the circuit board mounting an electronic component on the two electrode pads on a wiring board with solder and sealing the electronic component with a sealing resin; and to provide a method of manufacturing the same. SOLUTION: The first electrode pad 12 and the second electrode pad 14 are formed on an upper surface of the wiring board 10. A first solder resist 16 and a second solder resist 18 respectively surround the outer peripheries of the first electrode pad 12 and the second electrode pad 14. The electronic component 20 is connected with the first electrode pad 12 and the second electrode pad 14 via the solder. The electronic component 20 is sealed with the sealing resin on the wiring board 10. Sectional areas of openings 26a, 26b in a gap 26 surrounded by the wiring board 10, the first solder resist 16, the second solder resist 18 and the electronic component 20 are larger than that of a central part 26c of the gap 26. COPYRIGHT: (C)2011,JPO&INPIT |
