| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a smaller piezoelectric device with higher connection reliability and a manufacturing method for the same. <P>SOLUTION: The piezoelectric device 10 includes a piezoelectric vibration piece 60 provided with a connecting electrode pad 64, and a semiconductor device 40 electrically connected to the connecting electrode pad 64 and having an electrode pattern 50 supporting the piezoelectric vibration piece 60. The electrode pattern 50 has one end connected to a pad of the semiconductor device 40 and the other end connected to the connecting electrode pad 64. A bending portion 52 which rises in a direction separating from one principal surface 43 of the semiconductor device 40 is formed between one end and the other end, and resin is formed at the bending portion 52 between the one principal surface 43 and the electrode pattern 50. <P>COPYRIGHT: (C)2011,JPO&INPIT |
