| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate having a metallized composition of a low resistance used by low temperature baking and an electric circuit of a low resistance without void in an interface between it and an alumina substrate, and a manufacturing method thereof. SOLUTION: At least one kind of Zr, Al, Li, Mg and Zn is incorporated by an amount of 0.05 to 3.0 pts.wt. in metallic conversion to a composition of 100 pts.wt. containing Cu at the ratio of 10 to 70 vol.% and W and/or Mo at the ratio of 30 to 90 vol.%. |
