发明名称 |
Arrangement structure of electromagnetic band-gap for suppressing noise and improving signal integrity |
摘要 |
An electromagnetic-wave suppression structure in a multilayer PCB or package structure is supplied with a power to be used therein by a power distribution network including a power plane and a ground plane. The multilayer PCB and package includes: an electromagnetic-wave suppression structure including an electromagnetic band-gap; and the electromagnetic-wave suppression structure is formed at a specific portion(s) of the power plane and/or the ground plane to suppress noises.
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申请公布号 |
US8004369(B2) |
申请公布日期 |
2011.08.23 |
申请号 |
US20090578849 |
申请日期 |
2009.10.14 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
KWON JONG HWA;SIM DONG-UK;KWAK SANG IL;YUN JE HOON;KIM CHANG-JOO |
分类号 |
H04B3/32 |
主分类号 |
H04B3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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