发明名称 METHOD OF GRINDING WORKPIECE
摘要 PROBLEM TO BE SOLVED: To provide a method of grinding a workpiece without causing any damage thereto. SOLUTION: The method of grinding the workpiece includes an arrangement step of arranging the workpiece on an adhesive sheet having an adhesive layer formed on a base material so that the surface side thereof abuts against the adhesive layer, a thinning step of thinning the workpiece arranged on the adhesive sheet to have a predetermined thickness by grinding the backside thereof while curing the adhesive layer by cooling the adhesive sheet, and a removing step of removing the workpiece subjected to thinning from the adhesive sheet. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011159707(A) 申请公布日期 2011.08.18
申请号 JP20100018590 申请日期 2010.01.29
申请人 DISCO ABRASIVE SYST LTD 发明人 KAJIYAMA KEIICHI;MASUDA TAKATOSHI;YAMASHITA SHINJI
分类号 H01L21/304;B24B7/22;H01L21/683 主分类号 H01L21/304
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