| 摘要 |
<p>The device (10) has a circuitry carrier (110) arranged on a cabinet (100), and a power component (120) arranged on the carrier. A heat guide element (130) i.e. film, is arranged in the cabinet, and stays in thermal contact with the power component, where the guide element is formed from a material selected from graphite, copper, aluminum or ceramic material. Another heat guide element (140) i.e. metallic spring element, stays in thermal contact with the former heat guide element, and partially stays in thermal contact with the cabinet, where the latter heat guide element is malleably formed.</p> |
