发明名称
摘要 A heat-dissipation apparatus comprises a first heat conductive plate, a second heat conductive plate which bonds the first conductive plate, and a fin assembly. The first heat conductive plate has a plurality of first protrusions and a plurality of passageways interposed between the first protrusions. The second heat conductive plate has a plurality of second protrusions, and these second protrusions wedge in the passageways on the first conductive plate to interpose between the first protrusions. The fin assembly has a plurality of individual heat-dissipation fins, and part of each heat-dissipation fin is sandwiched tightly between the first protrusion and the second protrusion. The heat-dissipation apparatus is simply with punching to complete assembling and further to be provided with excellent efficiency
申请公布号 KR101057595(B1) 申请公布日期 2011.08.18
申请号 KR20090033188 申请日期 2009.04.16
申请人 发明人
分类号 H05K7/20;G06F1/20 主分类号 H05K7/20
代理机构 代理人
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