| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus which can suppress the temperature change of a plating solution important for the formation of a plated layer and can form a smooth and uniform plated layer without using an expensive plating solution in a large amount. SOLUTION: The plating apparatus includes a plating tank which is horizontally rotatable about a vertical axis, a negative electrode disposed in the inner peripheral part of the plating tank, and a positive electrode disposed in the central part of the plating tank. The plating tank holds a plating solution and is arranged in an outer tub holding a temperature control solution which keeps, decreases, or increases the temperature of the plating solution. The peripheral part of the plating tank is in contact with the temperature control solution. COPYRIGHT: (C)2011,JPO&INPIT |
