SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, ELECTRONIC APPARATUS, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve product yield during the manufacture of the devices and obtain a high manufacturing efficiency.

SOLUTION: A guard ring GR is formed of a material different from that of a semiconductor substrate 101 in the inner side of the chip area CA side than the portion diced in a scribe area LA. The guard ring GR has slits and the electric charges accumulated in the inner portion surrounded by the guard ring GR can be evacuated from the inner portion to the outer portion through the slits SL.

COPYRIGHT: (C)2011,JPO&INPIT