| 摘要 |
According to one embodiment, a package for housing semiconductor element includes: a base plate including a top surface and a recessed portion formed as a downwardly-recessed portion of the top surface; a peripheral wall provided on the top surface of the base plate; a lid provided on an upper side of the peripheral wall and forming a semiconductor element housing space in cooperation with the base plate and the peripheral wall; and a feed through terminal including a bottom end and fixed to the recessed portion so that the bottom end is located at a lower position than the top surface of the base plate except the recessed portion. |
