发明名称 Method of forming metal ion transistor
摘要 A method of forming a metal ion transistor comprises forming a first electrode in a first isolation layer; forming a second isolation layer over the first isolation layer; forming a first cell region of a low dielectric constant (low-k) dielectric over the first electrode in the second isolation layer, the first cell region isolated from the second isolation layer; forming a cap layer over the second isolation layer and the first cell region, at least thinning the cap layer over the first cell region; depositing a layer of the low-k dielectric over the second isolation layer and the first cell region; forming metal ions in the low-k dielectric layer; patterning the low-k dielectric layer to form a second cell region; sealing the second cell region using a liner; and forming a second electrode contacting the second cell region and a third electrode contacting the second cell region.
申请公布号 US7998828(B2) 申请公布日期 2011.08.16
申请号 US20100725817 申请日期 2010.03.17
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;INFINEON TECHNOLOGIES NORTH AMERICA 发明人 CHEN FEN;FISCHER ARMIN
分类号 H01L21/34;H01L21/00;H01L21/20;H01L21/335;H01L21/339;H01L21/36;H01L21/76;H01L21/8232;H01L21/84;H01L27/148;H01L29/12;H01L51/40 主分类号 H01L21/34
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