| 摘要 |
A FLEXIBLE SUBSTRATE (112) HAVING A CONDUCTIVE PATTERN (132,133) AND A NON-FLEXIBLE BASE MATERIAL(112) HAVING RIGIDITY ARE DISPOSED ADJACENT TO EACH OTHER IN A HORIZONTAL DIRECTION. AN INSULATING LAYER (111,113) CONTAINING AN INORGANIC MATERIAL (111A, 111B, 113A, 113B) COVERS THE FLEXIBLE SUBSTRATE (13) AND THE NON-FLEXIBLE BASE MATERIAL (112) SO AS TO EXPOSE AT LEAST A PART OF THE FLEXIBLE SUBSTRATE(13). A VIA (116,141) WHICH REACHES THE CONDUCTIVE PATTERN (132,133) OF THE FLEXIBLE SUBSTRATE (13) IS FORMED IN THE INSULATING LAYER, A WIRE (117,118,142,143) EXTENDING TO THE CONDUCTIVE PATTERN (132,133) IS FORMED THROUGH THE VIA (116, 141) BY PLATING. ON THE INSULATING LAYER (111, 113), AN UPPER INSULATING LAYER (114,115,144,145) IS LAMINATED, AND A CIRCUIT (123,150) IS FORMED.
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