| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently and continuously peel a thin film from an object on which a film is adhered through an adhesive, for disassembling a structure composed of the thin film and the object into respective materials for a recycling purpose. <P>SOLUTION: The device for peeling a thin film from a structure composed of the thin film and the object on which the film is adhered through an adhesive includes: a heating section which heats the adhesive; a peeling section which peals the thin film from the object; and a section for moving the adhesive having adhered to the thin film peeled by the peeling section. <P>COPYRIGHT: (C)2011,JPO&INPIT |
