发明名称 LAMINATED CIRCUIT MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a circuit material having less reflections and radiation, even at ultra-high frequencies or in ultrahigh-rate signal transmissions and low loss, because the characteristic impedance can be made small. SOLUTION: A method for lowering the electrical resistance of a circuit material such that includes a conductor layer, including a single atom layer or a plurality of atom layers including a single element and a constrained layer including a single atom layer or a plurality of atom layers that include a single element or a plurality of elements, forming a bond stabler than the atomic bond between the elements configuring the conductor layer, and the atoms of the conductor layer and the constrained layer are laminated in an atomic alignment state (heterostructure). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011155280(A) 申请公布日期 2011.08.11
申请号 JP20110056487 申请日期 2011.03.15
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 FUJIWARA HIDEMICHI
分类号 H01L21/3205;C23C14/14;H01L21/28;H01L21/285;H01L23/52 主分类号 H01L21/3205
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