| 摘要 |
Means for decreasing parasitic inductance by a realistic mounting method is provided. On a surface layer of a semiconductor package, there is provided a ground pad having a plurality of comb-tooth-shaped ground pads which are connecting points for wire bonding and are protruded on the surface layer of the semiconductor package. A power-supply pad is arranged between the comb-tooth-shaped ground pads. Two long and short ground wires are arranged in one comb-tooth-shaped ground pad. Also, two long and short power-supply wires are arranged in one power-supply pad. By arranging the long ground wire and the long power-supply wire so as to be parallel and close to each other and arranging the short power-supply wire and the short ground wire so as to be parallel and close to each other, the parasitic inductance is decreased.
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