STACKED SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A stacked semiconductor package is provided to reduce the required time and the process for manufacturing a stacked semiconductor package by forming the stacked semiconductor package by not a chip but a sub semiconductor chip module unit in which a plurality of semiconductor chips is laminated. CONSTITUTION: A sub substrate includes a first semiconductor chip with a first bonding pad in which a first sub connection pad is connected with, a first side in which a first connection pad is formed, and a second side facing with the first side. A semiconductor chip module(100) is laminated on the first side and includes at least more than two sub semiconductor chip modules(200) including at least more than two second semiconductor chips with a second bonding pad which is connected to the first sub connection pad. A main board(120) has a main connection pad which is connected to the first sub connection pad while supporting the semiconductor chip module.