| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing a semiconductor chip are provided to manufacture a semiconductor chip suitable for processing data at high speed and a semiconductor package including the same by storing a passive device at the lower part of the semiconductor chip with a recess part. CONSTITUTION: A substrate has an upper side(230a) in which a first and a second connection pad(222,223) are arranged and a lower part(230b) in which a third connection pad is arranged. A passive device is attached on the second connection pad in the upper side of the substrate. A semiconductor chip is attached to the upper side of the substrate and has a recess part in which a bonding pad and the passive device are accepted is. A connecting member interlinks the bonding pad of the semiconductor chip with the first connection pad of the substrate. |
